Our Machinery & Equipment - Advanced SMD Line

State-of-the-Art Manufacturing Equipment

Our facility is equipped with the latest automated machinery from leading global manufacturers, ensuring precision, quality, and efficiency in every project

15+

Advanced Machines

100%

Automated Line

Japanese

Technology

50K+

Parts/Hour

Premium Equipment

DEK Solder Paste Printer (Japan)

Our fully automatic DEK solder paste printer, imported from Japan, represents the pinnacle of precision printing technology. This advanced system ensures consistent, accurate solder paste deposition for even the most demanding applications.

Key Features

Fully automatic operation with vision alignment system
Precision printing accuracy of ±0.01mm
Suitable for 0201 and fine pitch components
Automatic stencil cleaning system
3D solder paste inspection (SPI) capability
User-friendly interface with recipe storage

Technical Specifications
Print Accuracy	±0.01mm (±10μm)
Maximum PCB Size	500mm x 400mm
Minimum Component Size	0201 (0.6mm x 0.3mm)
Throughput	Up to 180 boards/hour
Vision System	High-resolution cameras

High Speed

High-Speed Pick and Place Machine

Our advanced pick and place machines feature high-speed component placement capabilities with exceptional accuracy. Equipped with multiple placement heads and intelligent feeder systems for maximum productivity.

Capabilities

Multi-head placement system for high throughput
Component range: 0201 to 50mm x 50mm
BGA, QFN, QFP placement capability
Advanced vision system for precise alignment
Automatic nozzle changer
Feeder capacity: 100+ feeders
Online/offline programming support

Performance Highlights

Our pick and place machines can handle over 50,000 components per hour with a placement accuracy of ±0.03mm. The intelligent software optimizes component placement sequences for maximum efficiency and minimal production time.

Technical Specifications
Placement Speed	50,000+ CPH (Chips Per Hour)
Placement Accuracy	±0.03mm (30μm)
Component Size Range	0201 to 50mm x 50mm
Fine Pitch Capability	0.3mm pitch
BGA Pitch	0.4mm minimum

8-Zone Technology

8-Zone Reflow Oven

Our advanced 8-zone reflow oven provides precise temperature control for optimal solder joint formation. The multiple heating zones ensure uniform heat distribution and perfect reflow profiles for all component types.

Advanced Features

8 independent heating zones for precise control
Nitrogen atmosphere capability for lead-free soldering
Multiple profile storage and management
Real-time temperature monitoring
Automatic width adjustment
Energy-efficient design with cooling zones
Suitable for lead-free and leaded processes

Temperature Precision

The 8-zone configuration allows for optimal heating ramps, soak zones, and cooling rates, ensuring defect-free solder joints even for temperature-sensitive components like BGAs and large ground planes.

Technical Specifications
Heating Zones	8 Independent Zones
Temperature Range	Room Temp to 350°C
Temperature Accuracy	±1°C
Conveyor Speed	0-150 cm/min
PCB Width	50-400mm (adjustable)

Quality Inspection

Automated Optical Inspection (AOI)

Our state-of-the-art AOI system uses advanced imaging technology to detect defects and ensure 100% quality inspection of assembled PCBs. High-resolution cameras and intelligent software identify even the smallest anomalies.

Inspection Capabilities

Component presence/absence verification
Component polarity and orientation check
Solder joint quality inspection
Tombstone and bridging detection
Component placement accuracy verification
Defect classification and reporting
Statistical process control (SPC)

Technical Specifications
Camera Resolution	High-definition multi-angle
Inspection Speed	Up to 120 boards/hour
Detection Range	0201 to large components
Accuracy	99.9% detection rate
Lighting System	Multi-angle LED illumination

Advanced Inspection

X-Ray Inspection System

Our X-Ray inspection system provides non-destructive testing for hidden solder joints, making it essential for BGA, QFN, and other components where visual inspection is impossible.

Inspection Applications

BGA void and ball inspection
QFN solder joint verification
Through-hole solder fill analysis
Connector pin inspection
Internal component alignment
Wire bond inspection

Quality Assurance

X-Ray inspection is crucial for ensuring the reliability of BGA and QFN assemblies. Our system can detect voids, insufficient solder, and other hidden defects that could lead to field failures.

Precision Rework

BGA Rework Station

Professional BGA rework station equipped with precision heating systems, optical alignment, and automated controls for safe component removal and replacement.

Features

Precision temperature control system
Optical alignment system
Multiple heating profiles
BGA reballing capability
Safe component removal without PCB damage
Suitable for all package types

Technical Specifications
Component Size Range	5mm x 5mm to 60mm x 60mm
Temperature Range	Room Temp to 450°C
Placement Accuracy	±0.02mm
Vision System	High-resolution optical

Additional Support Equipment

Complete production line with supporting equipment for end-to-end manufacturing

Solder Paste Storage

Temperature-controlled refrigeration system for solder paste storage, ensuring optimal material condition and extended shelf life.

PCB Cleaning System

Advanced cleaning system for removing flux residues and contaminants, ensuring clean and reliable assemblies.

Moisture Baking Oven

Specialized oven for moisture-sensitive component baking prior to assembly, preventing popcorning and delamination.

Conveyor System

Automated conveyor system connecting all production equipment for seamless board flow and reduced handling.

PCB Magazine Loader

Automatic board loading and unloading system for efficient batch processing and operator convenience.